| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing electronic components capable of controlling deterioration of reliability and mounting failure. SOLUTION: With preparing a chip element 1 and a conductive green sheet 31, a conductive paste 33 and the conductive green sheet 31 are applied on an end surface 11 of a chip element 1. The conductive paste 33 between ridge portions R13 to R16 around the end surface 11 and an apex portion 1R and a main surface 31c of the conductive green sheet 31 covers the ridge portions R13 to R16 and the apex portion 1R. The conductive paste 33 is also applied from the main surface 31c of the conductive green sheet 31 to an end surface 31e and to an end portion 31g of a main surface 31d. The conductive paste 33 and the conductive green sheet 31 are dried and the end portions of the conductive green sheet 31 are modified by shrinking the conductive paste 33 so that they could fit along the ridge portions R13 to R16 and the apex portion 1R. Then a conductive layer containing conductive materials is formed and burnt to form an external electrode. COPYRIGHT: (C)2009,JPO&INPIT
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