| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device reducing crosstalk noise produced in a bonding wire, even if an integrated circuit chip is not enlarged, without having to change the design of the integrated circuit chip. <P>SOLUTION: The device is provided with a substrate 31, having the integrated circuit chip 1; a first ground pattern part 2 holding the integrated circuit chip 1; power conductor parts 3 and 4 installed at a periphery of the first ground pattern part 2; a signal line trace 7, disposed at a periphery of the power conductor parts 3 and 4; and a second ground pattern part 5, disposed between the power conductor parts 3 and 4 and the trace 7; a signal line wire 6 connecting the integrated circuit chip 1 and the signal line trace 7; and a ground wires 8 connecting the first ground pattern part 2 and the second ground pattern part 5. <P>COPYRIGHT: (C)2009,JPO&INPIT |
