发明名称 POSITIVE PHOTOSENSITIVE POLYMER COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive polymer composition having high radiation sensitivity and useful for forming a patterned polymer film obtained by development with an aqueous alkali solution and having high transparency, a low dielectric constant, high solvent resistance, high water resistance, high acid resistance, high alkali resistance, high heat resistance and excellent adhesion to a substrate. <P>SOLUTION: The positive photosensitive polymer composition contains a copolymer formed by radical polymerization of monomers including a radical polymerizable monomer (a1) having a (meth)acryloyl group and an alkoxy end-blocked polyalkylene glycol group, and a 1,2-quinonediazide compound, wherein the composition may further contain a copolymer formed by radical polymerization of monomers not including the monomer (a1). <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009168992(A) 申请公布日期 2009.07.30
申请号 JP20080005515 申请日期 2008.01.15
申请人 CHISSO CORP 发明人 TAKAHASHI TOSHIYUKI;WATANABE EIJI;EGASHIRA TOMOHIRO;KIMURA YUKI
分类号 G03F7/023;G02F1/1333;G03F7/004;G03F7/075;G03F7/40;H01L21/027 主分类号 G03F7/023
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