| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve robust properties on productions to performance variations among semiconductor production devices when there are a plurality of the production devices used for producing semiconductor products. <P>SOLUTION: Danger points are extracted in consideration of the performance variations of exposure systems used for the productions having effects on finishing shapes on substrates. When process capabilities at the danger points are lower than desired ones on a production planning, the process capabilities at the danger points are improved by the changes or the like of process conditions. <P>COPYRIGHT: (C)2009,JPO&INPIT |
