发明名称 MULTILAYER ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent the decrease of the capacitance of a multilayer electronic component caused by the breakage of joints of an external electrode and internal electrodes by relaxing stress caused by a difference between a wiring substrate and an electronic component base body. SOLUTION: A multilayer ceramic capacitor 1 has a structure having the electronic component base body 2 in which the internal electrodes 4 are alternately stacked through ceramic dielectrics 3 composed mainly of barium titanate, and the external electrode 5 formed on the surface of the base body where leading terminals 4a of the internal electrodes 4 are exposed. The external electrode 5 has an underlying metal layer 5a which closely contacts with the base body 2 and electrically connected with the leading terminals 4a, a first plated metal layer 5b to protect the underlying metal layer, and a second plated metal layer 5c to improve solder wettability with the first plated metal layer to protect the underlying metal layer 5a. Grooves 6 which extend vertically against the internal electrodes 4 and contact with the internal electrodes 4 are formed in the vicinity of the leading terminals 4a of the base body 2. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009170706(A) 申请公布日期 2009.07.30
申请号 JP20080008069 申请日期 2008.01.17
申请人 TAIYO YUDEN CO LTD 发明人 NAKAMURA TOMOAKI;KURABAYASHI MASAMI;TAWARA MIKIO;NISHIKAWA JUN;SAITO KENJI;SHIBAZAKI SHOJI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
代理机构 代理人
主权项
地址