| 摘要 |
PROBLEM TO BE SOLVED: To prevent the via fracture of a filled stack via which is caused by the stress applied to a wiring board comprising a multi-layer built-up board, etc., with respect to the wiring board and a semiconductor device. SOLUTION: The wiring board has a conductor layer, a first recessed portion formed in the surface of the conductor layer, a first insulating layer formed on the conductor layer, a first opening portion formed in the first insulating layer and exposing the first recessed portion to the external, a first filled via disposed in the first opening portion and at least whose one portion is embedded in the first recessed portion, a second insulating layer formed on the first insulating layer and the first filled via, a second opening portion formed in the second insulating layer and exposing the first filled via to the external, and a second filled via disposed in the second opening portion and connected with the first filled via. COPYRIGHT: (C)2009,JPO&INPIT |
