| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition source which improves the using efficiency of a target, and to provide a sputtering system. SOLUTION: A hole 26 is formed at a target 21, and a magnet apparatus 20 moves around the hole 26 of the target 21 by a magnet moving apparatus 4. In this way, an erosion region formed by the magnetic apparatus 20 is formed around the hole 26, and the target 21 is not present at a part serving as into a non-erosion region, thus the using efficiency of the target 21 is high. Since a grounding electrode 25 is arranged on the bottom face of the hole 26, a member exposed to the inside of the hole 26 is not sputtered. COPYRIGHT: (C)2009,JPO&INPIT
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