| 摘要 |
PROBLEM TO BE SOLVED: To make the film thickness of a coating film formed on a substrate uniform even when the number of times of coating treatment on the substrate increases. SOLUTION: A wafer W has a contact portion 60 held by a spin chuck, and an outer peripheral portion 61 outside it controlled at different temperatures. The temperature of the contact portion 60 is so controlled that when the wafer W is held by the spin chuck, the contact portion 60 and the spin chuck have the same temperature. The temperature of the outer peripheral portion 61 is controlled so that the thickness of a resist film on the wafer W becomes uniform. Then the temperature-controlled wafer W is held by the spin chuck and rotated and the wafer W being rotated is coated with a resist liquid to form the resist film having the uniform film thickness. COPYRIGHT: (C)2009,JPO&INPIT
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