| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an integrated package composed of a semiconductor die group in a small number of processes from a wafer where a plurality of semiconductor dies are formed. <P>SOLUTION: The method for manufacturing a semiconductor package that manufactures a flexible semiconductor assembly constituted of a semiconductor die group includes a step that affixes a flexible dielectric film onto the entire surface of a semiconductor wafer 100, where two kinds of a semiconductor dice 102, 104 are formed; a step that forms a die group 106 interconnected with the flexible dielectric film by electrically connecting the dice 102, 104 and cutting the dice 102, 104, until the cutting reaches the surface of the flexible dielectric film, and a step that separates the semiconductor 100 into a plurality of die groups 106 by cutting the die group 106. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
