| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a heat sink having heat-dissipating fins and a structure of the same, whereby solder can be avoided to reduce heat transfer loss, the overall manufacturing steps are simple, and more efficient heat dissipation of electronic elements can be achieved. <P>SOLUTION: The method for manufacturing the heat sink having heat-dissipating fins 3 and the structure of the same are provided. The method includes the steps of: providing a substrate 2 comprising a center portion 21 and a plurality of extending arms 22, a gap 23 being provided between each extending arm 22 and two adjacent extending arms 22; providing a plurality of heat-dissipating fins 3, the heat-dissipating fins 3 being inserted into the gaps 23 between the extending arms 22, each heat-dissipating fin 3 comprising a base piece 31 and two heat-dissipating plates 32, the two heat-dissipating plates 32 of each heat-dissipating fin 3 being inserted into the gaps 23 between the extending arm 22 and two adjacent extending arms 22; and bending and pressing each extending arm 22 of the substrate 2 and abutting both the side walls of each extending arm 22 against both the surfaces 323 of each heat-dissipating plate 32. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
