| 摘要 |
PROBLEM TO BE SOLVED: To provide a power converter capable of highly efficiently cooling a semiconductor element for converting power without causing upsizing, a cost rise, an increase in thermal resistance, and stress concentration, and to provide a manufacturing method thereof. SOLUTION: The power converter has a first semiconductor element main surface electrode structure 27 which has a semiconductor element 11 having a main surface electrode, a first electrode 15 having insulation members 24 on a rear surface end portion together with a step difference receiving portion 15a for inserting the semiconductor element 11, positioning the main surface substrate on the receiving portion 15a, disposed so as to cover the semiconductor element 11, and bonded to the semiconductor element 11 via the insulation member, a heat spreader 19 having a heat transmission region 19a closely disposed to a wire bonding wire 26 for electrically connecting the main surface electrode and the first electrode 15, and mounted on the main surface electrode to the first electrode 15 via a heat conductive material; a first substrate 13 mounted by solder on each of the rear surfaces of the structure 27 and the insulation member 24; and a first heat radiator 17 having the first substrate 13 mounted via an insulator. COPYRIGHT: (C)2009,JPO&INPIT |
