| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing facility and a manufacturing method of a semiconductor device capable of preventing occurrence of resin leakage and a substrate crack, minimizing dispersion of a sealing resin inside dimensions, and inexpensively manufacturing a semiconductor device well. SOLUTION: This semiconductor device manufacturing facility is provided with a resin seal molding die body formed by oppositely arranging an upper die 1 and a lower die 2, having a plurality of cavities 6 in the die body, and equipped with a cavity plate 9 slidable in a part facing the cavities 6. The semiconductor device manufacturing facility is also provided with a pressure sensor 12 detecting pressure acting in the insides of the cavities 6, and an electric control mechanism 14 controlling pressing force of the cavity plate 9 in response to the pressure detected by the pressure sensor 12. COPYRIGHT: (C)2009,JPO&INPIT
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