| 摘要 |
Methods and apparatus for creating a filled, backdrilled plated through hole in a printed circuit board are disclosed. According to one aspect of the present invention, a method includes defining a hole in a printed circuit board panel. The hole has a first surface, and includes at least a first portion and a second portion. The method also includes plating the first surface with a conductive material, to create a plated surface, and removing at least a first area of the plated surface. The first area of the plated surface is associated with the second portion, and removing the first area of the plated surface includes expanding a size of the hole associated with the second portion. Finally, the method includes filling the hole with a non-conductive material.
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