| 摘要 |
The carrier structure has a radiator box (3) with a radiator box upper side (8). An electrically isolating carrier layer (4) is provided with a carrier layer lower surface (9) and a carrier layer top side (10) serving as base for a partial structure for assembly of construction element (6) of an electronic conducting component (1). The carrier layer is made of ceramic material or plastic. A material is provided as particle coating material from the group of glass, glass foam, metal, particularly copper and aluminum, a metal foam, a thermoplastic plastic, a silicone, acrylene and polyacrylene. An independent claim is included for a method for manufacturing a carrier structure for an electronic conducting component. |
