发明名称 COOLING STRUCTURE OF COMPUTER
摘要 <p><P>PROBLEM TO BE SOLVED: To realize a structure which supplies the most suitable cooling air quantity at a computer system in which a plurality of cases where a plurality of high heating parts are mounted on the same board are mounted in parallel. <P>SOLUTION: The pressure loss of the part with a high load at a heating element on a board 8 is lowered and the pressure loss of the part with a low load at the heating element on the board 8 is raised by installing the air quantity regulating plate 9 consisting of two directional shape-memory alloy which works by temperature of mounted heat sink 2 at intake side or exhaust side. Thus, not only the most suitable cooling air quantity in a case 1 is supplied but also the passing air quantity of the case can be regulated according to necessary cooling air quantity due to load unevenness of a plurality of cases 1 mounted in parallel. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009169873(A) 申请公布日期 2009.07.30
申请号 JP20080009978 申请日期 2008.01.21
申请人 HITACHI LTD 发明人 MURAKAWA ATSUSHI;TSUBAKI SHIGEHIRO
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
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