| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal film laminate which improves environmental resistance and is also available for a plating background film or the like by improving the adhesion of a metal film, formed on a substrate, with the substrate by applying a metal microparticle dispersed body onto the substrate and sintering it through heating treatment, manufacturing method thereof, and metal wiring board employing the same. SOLUTION: A metal film laminate is characterized in that a plurality of layers of metal oxide films each formed from an organic metal compound and metal films each formed from a metal microparticle dispersed body are laminated on a substrate and the first film to be formed on the substrate is a metal oxide film. COPYRIGHT: (C)2009,JPO&INPIT
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