| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing lid and package, which can shorten and simplify the process of forming a hermetic sealing mechanism. SOLUTION: The package P is configured such that a package body 10 for housing an electronic component 100 is sealed by the sealing lid 20; the sealing lid 20 includes a sheet-like metal plate 21, and a clad sheet comprising a clad layer 22, which is configured by fixing or welding a brazing material powder comprising a brazing material composition onto one surface of the metal plate 21. COPYRIGHT: (C)2009,JPO&INPIT
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