| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer base film for a surface protective tape, wherein breakage of a semiconductor wafer can be restrained at the time of a back-side grinding process for the semiconductor wafer. SOLUTION: The base film, which is intended for a surface protective tape to protect a circuit formation side of a semiconductor wafer, is used at the time of back-side grinding of the semiconductor wafer. A layer containing polyethylene-based resin with a density of 0.910 to 0.920 g/cm<SP>3</SP>is used as an intermediate layer (B), while a layer containing ethylene-vinyl acetate copolymer is used as a front-side layer (A) and a back-side layer (C). COPYRIGHT: (C)2009,JPO&INPIT
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