PROCESS FOR FORMING METALLIC-FILM PATTERN

摘要

A metallic-film (metallic-die) pattern for producing a product of metal processing or a fine part. Also provided is a process for easily forming the pattern. The process for forming the metallic-film pattern is characterized by comprising applying a curable resin composition (4) to a substrate (3) on which a seed film (2) has been deposited, using a mold (5) having a given pattern to transfer the given pattern of the mold (5) to the curable resin composition (4) based on the movement of the mold (5) relative to the substrate (3), curing the curable resin composition (4) having the given pattern of the mold (5) transferred to the curable resin composition (4), detaching the mold (5) from the cured resin (4'), removing the cured resin (4") remaining as a residue in a region (8), forming a metallic film (11) in a region (10), and removing the cured resin (4') remaining on the substrate. Use of a plastic mold and a visible-light-curable resin containing a polymerizable compound having a weight-average molecular weight not higher than a specific value enables the process to more easily yield a metallic-film pattern.