| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film forming apparatus capable of forming a thin film by discharging and applying a material solution on a substrate from an inkjet head under a reduced pressure to have a uniform film thickness and each simplified constitution installed without deteriorating the function of a discharge coating. SOLUTION: The thin film forming apparatus is constituted of a plurality of inkjet heads respectively discharging the material solution from a plurality of nozzles formed with a fixed interval on the substrate, a coating solution housing container for supplying the material solution using the water head difference between the nozzle surface and the liquid surface to the inkjet heads, a substrate transporting table for placing the substrate and moving horizontally and a pressure reduced chamber housing the inkjet head, the coating solution housing container and the substrate transporting table and provided with the pressure reduced chamber, wherein the coating solution housing container directly connected to the inkjet head is placed under the same reduced pressure atmosphere. COPYRIGHT: (C)2009,JPO&INPIT
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