发明名称 HIGH-FREQUENCY MODULE
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency module that has the improved shielding property and space isolation of the whole module by using a cutoff block. SOLUTION: The high-frequency module comprises a high-frequency circuit part, a circuit board 2 having ground surfaces on both surfaces where the high-frequency circuit part is mounted, a high-frequency metal package 5d containing a high-frequency power amplifying element, a metal case 1 which electrically connects a ground surface of the high-frequency metal package 5 and one ground surface of the circuit board 2 to each other and also has a frame, a metal cover 14 which is fixed to an opening hole of the frame of the metal case 1 and forms a sealed space inside, the conductive cutoff block 11 which is disposed in the sealed space and partitions off the sectioned high-frequency circuit part, and is electrically connected to the other ground surface of the circuit board 2, a first elastic conductor 10 which is inserted into and contacted with a gap between the cutoff block 11 and high-frequency metal package 5d, and a second elastic conductor 13 which is inserted into and contacted with a gap between the cutoff block 11 and metal cover 14. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009170843(A) 申请公布日期 2009.07.30
申请号 JP20080010385 申请日期 2008.01.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 OGOMI TOMOKAZU;TOCHI TORU
分类号 H05K9/00 主分类号 H05K9/00
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