| 摘要 |
A process for producing a circuit component (10) having a double-sided circuit device (18) between a pair of substrates (12,14). The process entails depositing a solder material on contact areas (36,40) on surfaces (46,48) of the substrates (12,14), placing a first of the substrates (14) within a cavity (68) in a receptacle (62), and then placing a lead member (30,32) on the substrate (14) so that the lead member (30,32) is supported by the receptacle (62) and a portion (60) of the lead member (30,32) is aligned with a portion (50,52) of the contact area (36) of the substrate (14). A fixture (64) is then placed on the lead member (30,32) and over the substrate (14) so that the fixture (64) is supported by the receptacle (62). After aligning the circuit device (18) with the contact area (40) of the remaining substrate (12), the substrate-device assembly (12,18) is placed in an aperture (78) in the fixture (64) so that a surface of the device (18) electrically contacts the contact area (40) of the first substrate (14) and the opposite surface of the device (18) electrically contacts the contact area (36) of the second substrate (12). The resulting fixtured assembly then undergoes reflow. |
