发明名称 SUBSTRATE, CONNECTING COMPONENT, AND MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate, a connecting component, and a mounting method, keeping low viscosity of wax in a through-hole to facilitate infiltration of the wax into the through-hole and improving mounting reliability. SOLUTION: A substrate including a conductor layer, a through-hole, and a through-hole conductor formed on an inner wall of the through-hole, is equipped with a switch working as a connecting component which changes in shape depending on a temperature to connect or isolate between the conductor layer and the through-hole conductor. When an electronic component is mounted on the substrate, the through-hole is filled with molten wax to heat the switch, to have the conductor layer separated from the through-hole conductor. After brazing is completed, the switch is cooled, and the conductor layer and the through-hole conductor are connected with each other. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009170461(A) 申请公布日期 2009.07.30
申请号 JP20080003528 申请日期 2008.01.10
申请人 NEC ACCESS TECHNICA LTD 发明人 HARA JUNICHI
分类号 H05K3/34;H05K1/02;H05K1/11 主分类号 H05K3/34
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