发明名称 COOLING MEDIUM SENSOR ATTACHING STRUCTURE AND COOLING MEDIUM SENSOR ATTACHING METHOD
摘要 <p>A cooling medium sensor attaching structure comprises T-shaped joints (3, 8, 12, 14) in which one end of a main pipe portion (20) is a first connection portion (22), the other end of the main pipe portion is a sensor attaching portion (23), and a branched pipe portion (21) branched from the main pipe portion (20) is a second connection portion (24), and a cooling medium sensor (26) airtightly attached to the sensor attaching portion in such a manner that a thermistor (25) is housed in the sensor attaching portion (23). In the structure, the sensor attaching portion (23) side of the main pipe portion (20) is arranged to be higher than the first connection portion (22) side thereof in a state in which the first connection portion (22) and the second connection portion (24) of the T-shaped joints (3, 8, 12, 14) are connected with the piping of a cooling cycle (C).</p>
申请公布号 WO2009093282(A1) 申请公布日期 2009.07.30
申请号 WO2008JP00071 申请日期 2008.01.24
申请人 UBUKATA INDUSTRIES CO., LTD.;ORION MACHINERY COMPANY LIMITED;TAKEDA, TERUYUKI;KUROIWA, YOSHIROU;MARUYAMA, TSUYOSHI;SUGIMOTO, SEITAROU 发明人 TAKEDA, TERUYUKI;KUROIWA, YOSHIROU;MARUYAMA, TSUYOSHI;SUGIMOTO, SEITAROU
分类号 F25B49/02;G01K1/14;G01K7/22 主分类号 F25B49/02
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