| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique by which the roundness of the upper ridgeline part of a via land pad or circuit wiring is eliminated, and while forming an upper face of a circuit flat, a uniform plated circuit board can be produced. SOLUTION: An acid copper electroplating solution is disclosed which is obtained by adding a copper plating precipitation suppressor and a brightening agent to an acid copper plating fundamental composition containing at least copper ions, organic acid or inorganic acid and chlorine ions, and further adding a reducing agent thereto. A method for producing a fine wiring circuit is also disclosed which uses the above acid copper electroplating solution and fills copper into the part of a wiring circuit formed by a resist on the object to be plated by electroplating. COPYRIGHT: (C)2009,JPO&INPIT |
