| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a problem of a conventional semiconductor device inspection apparatus which is difficult to be applied, without any modification, for inspecting the filled state of an underfill agent that does not completely block light even when bubbles are contained. <P>SOLUTION: An inspection apparatus 1 is used for inspecting a semiconductor device 10 wherein a semiconductor package 12 is connected to a circuit board 11 through bumps 13 formed on one surface of the semiconductor package 12, and a gap 15 between the connected semiconductor package 12 and circuit board 11 is filled with an underfill agent 16. The inspection apparatus 1 comprises: a light emitter 2 which emits light into the underfill agent 16 of the semiconductor device 10; a light receiver 3 which receives light emitted from the light emitter 2 and passing through the underfill agent 16; and a controller 5 which determines the amount of light received by the light receiver 3 and evaluates the filled state of the underfill agent 16 on the basis of the amount of received light. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
