| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil for a circuit board which has a sufficient bending resistance characteristic even after surface processing such as surface roughing processing using roughing plating even when a final cold rolling processing degree is≤90% in a rolled copper foil, and which can achieve further improvement of the bending resistance characteristic even when the rolling processing degree is increased by controlling a recrystallization temperature. SOLUTION: In the copper foil for the circuit board, a copper thin film 3 and a non-copper metallic thin film 4 composed of nickel, cobalt or their alloy, at least one layer or more in each film, are laminated on the surface of at least one of front and rear faces of a base material 1 composed of a copper foil. COPYRIGHT: (C)2009,JPO&INPIT
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