| 摘要 |
PROBLEM TO BE SOLVED: To provide a shield cap for a module capable of preventing a non-solder state caused by curvature of a mother board due to head during reflow soldering, and a semiconductor device. SOLUTION: Disclosed is the shield cap having an end connected to a base substrate 6 with sealing solder 4 for a module 1 connected to the mother board 5 using a solder bump 2. A chip component 7 etc., is shielded using a shield cap 3 for the module which is made at least partially of a shape memory alloy. COPYRIGHT: (C)2009,JPO&INPIT
|
