| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive member usable as an electrically connecting member and an inspection connector of an electronic part such as a semiconductor element even at the present time where high integration is further advanced by remarkably improving installation density of a conductive passage, to provide a metal-filled microstructure used as its anisotropic conductive member, and to provide a manufacturing method thereof. SOLUTION: This manufacturing method of the metal-filled microstructure obtained by filling a metal in through-holes of a base body having the though-holes having an average opening hole diameter of 5-500 nm with density not less than 2,000,000 pieces/mm<SP>2</SP>, includes at least a hydrophilicizing process of applying hydrophilicizing processing to the base body, and a metal filling process of filling the metal in the through-holes by applying plating processing after the hydrophilicizing process. COPYRIGHT: (C)2009,JPO&INPIT
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