| 摘要 |
<p>Improved constructions of power modules (1) for switching high power electrical loads are proposed. The modules consist of three constructive parts: a base plate (2), a top plate (4) and a three dimensionally structured interconnection network (3). The top plate carries capacitors (41,42) and contact areas. The base plate comprises control electronics, connectors and contact areas (201-206). It has good thermal conducting and high electrical isolating properties. The interconnection network (3) carries power semiconductor devices (e.g. MOSFET, IGBT) (3101,3111) and diodes (3102,3112). It is a folded network of bridging metal structures separated by air gaps. It comprises contacts for battery and power loads. Each conductive element (301,302, 313-316) contacts the base plate's contact areas and the capacitors in the top plate are contacted by the conductive structures for supply potential (301,302). These modules allow improved performance at lower amount of active components.</p> |
