CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VERTICAL STIFFNESS CONTROL METHOD

摘要

A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a plated through hole landing supporting the plurality of stacked vias. The plated through hole landing includes a compliant center zone; and spring-like stiffness-reducing connectors for connecting the compliant center zone of the plated through hole landing.