BONDING APPARATUS, AND METHOD FOR ADJUSTING HEIGHT OF BONDING STAGE ON BONDING APPARATUS

摘要

A bonding apparatus (10) includes a reference plane (11), a bonding arm (21) that rotates around a rotation center (15) disposed away from the reference plane (11) and makes a capillary (23) attached to the front edge operate to approach and move away obliquely relative to the reference plane (11), and an imaging device (25) to optically detect bonding positions on a semiconductor chip (41) and a lead frame (12). An angle of an optical axis (51) heading from the reference plane (11) toward the imaging device (25) with the reference plane (11) is made approximately equivalent to an angle of a moving line (35) at the front edge of the capillary (23) with the reference plane (11). This ensures to widen a bonding area using a simple mechanism, providing a high-speed and high-precision bonding apparatus.