| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for packaging a semiconductor, for improving the entire mechanical strength by using a photosetting resin. <P>SOLUTION: The method includes a step of arranging a chip 30 on a substrate 20 in a housing space 12 formed of at least an insulating unit 10 arranged on the top surface of the substrate 20; a step of completely insulating the chip 30 by forming a photosetting resin layer 40 in the housing space 12; a step of curing a part of the photosetting resin layer 40 by exposure and development processing to form a fully cured non-sacrificial portion 42 and an uncured sacrificial portion, and allowing the sacrificial portion to correspond to the chip 30; and a step of exposing an acting section 32 of the chip 30 to the outside by removing the sacrificial portion. According to this method, the photosetting resin layer has excellent rigidity and adhesive force to improve the mechanical strength of the entire package. Thus, the chip is unfailingly protected. <P>COPYRIGHT: (C)2009,JPO&INPIT |
