| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a method for acquiring a height-direction position of a specific part such as the lower end of an electric circuit component or a height dimension of a specific part of an electric circuit component by a method different from the conventional one, and a device suitable for executing the method. <P>SOLUTION: After extracting a BGA 110 from a component feeder by a suction nozzle 80b, the BGA is imaged from below by a lower-component image pickup device. Then, the BGA is imaged from the immediate lateral side by a side-component image pickup device 180. The horizontal width of an imageable region of the image pickup device 180 is smaller than the horizontal dimension of the side face of the BGA 110. The BGA 110 is positioned at a position, where a plurality of diagonally-arranged solder balls 120 are located on the imaging centerline of the image pickup device 180, on the basis of a relative position, obtained based on imaging from below, of the BGA 110 with respect to the image pickup device 180 so as to allow the image pickup device 180 to image the BGA. A height-direction position of the lower end of each ball 120 is acquired on the basis of image data obtained by imaging so as to use it for control or the like of a descending speed of the suction nozzle during mounting of the BGA. <P>COPYRIGHT: (C)2009,JPO&INPIT |
