| 摘要 |
PROBLEM TO BE SOLVED: To provide an etchant composition for a copper-containing material, which prevents a shape failure of a wire in a circuit with a fine pattern and can manufacture a printed wiring board (or film) that does not cause a short circuit. SOLUTION: The etchant composition for the copper-containing material is formed of an aqueous solution including: (A) 0.1 to 15 mass% of at least one oxidizing agent component selected from a cupric ion and a ferric ion; (B) 0.001 to 5 mass% of a glycol ether compound having one hydroxyl group; (C) 0.001 to 5 mass% of a compound containing at least one of ethylene oxide and propylene oxide added to active hydrogen of a (poly)amine compound; (D) 0.1 to 5 mass% of at least one phosphoric component selected from phosphoric acid and a phosphate; and (E) 0.1 to 10 mass% of at least one inorganic acid selected from hydrochloric acid and sulfuric acid, as indispensable components. COPYRIGHT: (C)2009,JPO&INPIT
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