| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that when a solder exclusion region is formed at a periphery of a solder bonding region and a connection place where a solder bonding is carried out is limited, adhesive strength for bonding and fixing an electronic component to be mounted on a circuit board decreases. <P>SOLUTION: Disclosed is a multilayer circuit board 10 having a first substrate 1 and a second substrate 2 bonded with an insulating adhesive 13 interposed, wherein the first substrate 1 has a first electrode terminal 3 and a first land 5 for mounting an electronic component 12, and the second substrate 2 has a second electrode terminal 4 disposed corresponding to the first electrode terminal 3 and electrically connected to the first electrode terminal 3, and a first through-hole 7 bored corresponding to the first land 5 to enable the electronic component 12 to be mounted on the first substrate 1 through it. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
