| 摘要 |
PROBLEM TO BE SOLVED: To improve heat resistance and transparency being problematic points of conventional epoxy resin-acid anhydride curing system sealants used for resin sealing of LED, etc. SOLUTION: A thermosetting resin composition comprises a silsesquioxane derivative expressed by formula (1), cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride, and another acid anhydride. COPYRIGHT: (C)2009,JPO&INPIT
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