发明名称 SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND WAFER LOADING/UNLOADING METHOD THEREOF
摘要 A semiconductor manufacturing apparatus and a wafer loading/unloading method thereof increase productivity. The semiconductor manufacturing apparatus includes a first boat and a second boat having a plurality of first slots and a plurality of second slots, respectively, and disposed such that the first slots and the second slots alternate each other, the first boat mounting a plurality of first wafers in the first slots to direct front faces of the first wafers in a predetermined direction, the second boat mounting a plurality of second wafers in the second slots to direct back faces of the second wafers in the predetermined direction; a reaction tube having an opening and containing the first and second boats mounting the first and second wafers; a plate sealing up the opening of the reaction tube containing the first boat and the second boat; a reaction gas supplier supplying reaction gas into the sealed reaction tube for a predetermined process; and a reaction gas exhauster exhausting the reaction gas from the reaction tube to the external of the reaction tube after the predetermined process.
申请公布号 US2009191042(A1) 申请公布日期 2009.07.30
申请号 US20090350705 申请日期 2009.01.08
申请人 PARK JUN-SIG;KIM JUNG-HYEON;SHIN JIN-HO;IVANOV GENNADY 发明人 PARK JUN-SIG;KIM JUNG-HYEON;SHIN JIN-HO;IVANOV GENNADY
分类号 H01L21/677;C23C16/458;H01L21/30 主分类号 H01L21/677
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