发明名称 PHASE-CHANGE MEMORY ELEMENT
摘要 A phase-change memory element with side-wall contacts is disclosed. The phase-change memory element comprises a bottom electrode. A first dielectric layer is formed on the bottom electrode. A first electrical contact is formed on the first dielectric layer and electrically connects to the bottom electrode. A second dielectric layer is formed on the first electrical contact. A second electrical contact is formed on the second dielectric layer, wherein the second electrical contact comprises an outstanding terminal. An opening passes through the second electrical contact, the second dielectric layer, and the first electrical contact. A phase-change material occupies at least one portion of the opening. A third dielectric layer is formed on and covers the second electrical contact, exposing a top surface of outstanding terminal. A top electrode is formed on the third dielectric layer, contacting the outstanding terminal.
申请公布号 US2009189140(A1) 申请公布日期 2009.07.30
申请号 US20080020489 申请日期 2008.01.25
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;POWERCHIP SEMICONDUCTOR CORP.;NANYA TECHNOLOGY CORPORATION;PROMOS TECHNOLOGIES INC.;WINBOND ELECTRONICS CORP. 发明人 CHEN FREDERICK T.
分类号 H01L45/00 主分类号 H01L45/00
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