发明名称 |
Bonding pad structure and debug method thereof |
摘要 |
The bonding pad structure includes a main bonding pad and a blank path. The blank path crosses through the main bonding pad for dividing the main bonding pad into a first sub-bonding pad and a second sub-bonding pad. The bonding pad structure may further include a solder covered on the blank path and the main bonding pad selectively. The main bonding pad is regarded as a closed circuit when the solder is covered on the blank path and the main bonding pad. The main bonding pad is regarded as a open circuit when the solder is not covered on the blank path and the main bonding pad. A debug method with the bonding pad structure is also disclosed.
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申请公布号 |
US2009189298(A1) |
申请公布日期 |
2009.07.30 |
申请号 |
US20080010571 |
申请日期 |
2008.01.28 |
申请人 |
WU FU-CHUNG;TSAI SHENG-YUAN |
发明人 |
WU FU-CHUNG;TSAI SHENG-YUAN |
分类号 |
H01L23/48;H01L21/44 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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