| 摘要 |
<p>Provided is a multilayer packaging structure wherein each substrate can be inspected after forming (manufacturing) the multilayer packaging structure. The multilayer packaging structure is provided with a first substrate (10) which is provided with a first electrode component; a second substrate (20) which is arranged to face the first substrate (10) and provided with a second electronic component; an intermediate member (40) which is provided with a space for storing the second electronic component; a conductive member (7) which is provided on the intermediate member (40); a first inspection electrode (11a), or the like, which is electrically connected to the first electronic component as an electrode for inspecting operation of the first electronic component; a connecting electrode (22a) on the second substrate side, or the like, which is electrically connected to the second electronic component as an electrode for electrical connection to the conductive member (7); and a second inspecting electrode (12a) or the like which is arranged on the first substrate as an electrode for inspecting operation of the second electronic component and electrically connected to the second electronic component through the conductive member (7), the connecting electrode (22a) on the second substrate side, and the like.</p> |
