发明名称 METHOD TO REDUCE DISLOCATION DENSITY IN SILICON
摘要 <p>A crystalline material structure is provided. The crystalline material structure includes a semiconductor structure being annealed at temperatures above the brittle- to-ductile transition temperature of the semiconductor structure, and cooled in an approximately linear time-temperature profile down to approximately its respective transition temperature To.</p>
申请公布号 WO2009094526(A1) 申请公布日期 2009.07.30
申请号 WO2009US31817 申请日期 2009.01.23
申请人 MASSACHUSETTS INSTITUTE OF TECHNOLOGY;HARTMAN, KATHERINE;SERDY, JAMES;BUONASSISI, TONIO 发明人 HARTMAN, KATHERINE;SERDY, JAMES;BUONASSISI, TONIO
分类号 H01L21/324;H01L31/04;H01L31/042 主分类号 H01L21/324
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