| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing, excellent in burning resistance, fluidity, continuous moldability, and soldering resistance, in spite of low cost, without using a brominated epoxy resin and an antimony compound. <P>SOLUTION: The epoxy resin composition for semiconductor sealing contains (A) an epoxy resin having a structure expressed by general formula (1), (B) a phenolic resin containing a plurality of aromatic rings in the molecule, (C) an inorganic filler, and (D) a triazole compound containing a mercapto group. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
