发明名称 Plating method
摘要 Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
申请公布号 US2009188804(A1) 申请公布日期 2009.07.30
申请号 US20090319753 申请日期 2009.01.12
申请人 ROHM AND HAAS ELECTRONIC MATERIALS LLC 发明人 KNOP JACEK M.;CARTER JOHN G.;CLEARY DONALD E.
分类号 C25D5/00;C25D7/00;C25D5/18;C25D21/12;H05K3/42;H05K3/46 主分类号 C25D5/00
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