发明名称 HEAT MANAGEMENT IN AN ELECTRONIC MODULE
摘要 In one example, an electronic module includes a printed circuit board and a housing at least partially enclosing the printed circuit board. The printed circuit board includes a heat-generating component. The housing includes a first case and a second case attached to the first case. The first and second cases cooperatively define a sealed cavity containing a fluid. The second case includes a thermal contact structure positioned proximate to the heat-generating component.
申请公布号 US2009190310(A1) 申请公布日期 2009.07.30
申请号 US20090351542 申请日期 2009.01.09
申请人 FINISAR CORPORATION 发明人 HOSKING LUCY G.
分类号 H05K7/20 主分类号 H05K7/20
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