发明名称 |
Vorrichtung und Verfahren zum Prozessieren eines Wafers |
摘要 |
<p>An method for processing a processing surface of a wafer by means of a processing-beam is disclosed. The method comprises moving the wafer and the processing-beam relative to each other so that the processing-beam scans the processing surface of the wafer in a scanning path having a curved course with continuously or stepwise changing radiuses. An apparatus is also disclosed.</p> |
申请公布号 |
DE112006003970(T5) |
申请公布日期 |
2009.07.30 |
申请号 |
DE20061103970T |
申请日期 |
2006.07.28 |
申请人 |
AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD. |
发明人 |
AIGNER, ROBERT |
分类号 |
H01J37/147;H01J37/317 |
主分类号 |
H01J37/147 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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