| 摘要 |
<p>A method of manufacturing an optical waveguide device which is capable of connecting light-receiving and light-emitting elements mounted on a board and an optical waveguide to each other with high accuracy. Insulation layers (22) are formed on a first surface of a metal substrate (20). A first photomask (25) is positioned by using an alignment mark (A) formed in the metal substrate, and exposure to light and development are performed to form conductor layers (28). A second photomask (23) is positioned on a second surface of the metal substrate opposite from the first surface by similarly using the above-mentioned alignment mark (A), and exposure to light and development are performed to form an opening (36) for optical coupling between a light-emitting element (40) and an optical waveguide film (41). The light-emitting element is mounted on pads of the conductor layers, and the optical waveguide film is fixed to the metal substrate using the optical coupling opening.</p> |
