摘要 |
In order to provide a reactor, a micro reactor chip, and a micro reactor system which can maintain high sensitivity without residual stresses on a crystal oscillator and unwanted oscillation modes, both surfaces of an AT-cut crystal plate 100 is deposited or sputtered with gold to prepare a detection electrode 601, an opposite electrode 602, and wiring to both electrodes. A resist is then formed on a cleaned silicon wafer. Polydimethylsiloxane (PDMS) is then poured onto the silicon wafer and allowed to cure. The PDMS is then peeled from the silicon wafer to form a groove 500 in the PDMS. The PDMS is then laid on the crystal plate. When the crystal substrate side is then irradiate with ultraviolet light the silicon-carbon bond between the crystal and the PDMS is cut, thus causing the crystal and the PDMS to bond to each other by means of a siloxane bond. The liquid introduction port and the liquid discharge port are then cut to form the reactor. A micro reactor chip and a micro reactor system are configured through the application of the construction of the reactor. |