| 发明名称 |
Power module for solid state relay |
| 摘要 |
<p>A power module that includes a lead frame having conductive pads molded in at the base thereof and a heatsink in thermal contact with the conductive pads through a thermally conductive adhesive.
</p> |
| 申请公布号 |
EP1507291(A3) |
申请公布日期 |
2009.07.29 |
| 申请号 |
EP20040019243 |
申请日期 |
2004.08.13 |
| 申请人 |
SILICONIX TECHNOLOGY C.V. |
发明人 |
FISSORE, SERGIO;GRANT, WILLIAM |
| 分类号 |
H01L23/495;H01L21/56;H01L23/057;H01L23/36;H01L25/16 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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