Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby

摘要

A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A plurality of protruding cores (optical interconnect lines) (3) are formed in a predetermined pattern on a base (1) and the under cladding layer. Thereafter, a thin metal film (4) is formed in grooves defined between adjacent ones of the cores (3). Electroplating is performed on the thin metal film (4) to fill the above-mentioned grooves with an electroplated layer (6a). The electroplated layer (6a) serves as electrical interconnect lines (6).
An over cladding layer (7) is formed to cover the cores (3) and the electrical interconnect lines (6).